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一种L频段小型化高隔离度功分放大组件的设计与实现

Design and Implementation of a Miniaturized High-Isolation Power Dividing and Amplifying Module for L-Band

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【作者】 张奡清; 乔创; 雷战; 蒲蔚妮; 张霄云;

【Author】 ZHANG Ao Qing;QIAO Chuang;LEI Zhan;PU Wei Ni;ZHANG Xiao Yun;Navigation Technology Institute;

【机构】 中国电子科技集团公司第二十研究所;

【摘要】 本文设计了一种适用于L频段的小型化功分放大组件,通过级联一分二功分器实现六路信号分配,结合低噪声放大器、滤波器和开关电路,既实现了天线接收信号功分及放大的功能,又优化了射频性能。文章通过设计指标分析、器件选型、仿真计算等过程,确定了功分放大组件的设计架构,设计采用多层PCB布局与混合工艺架构,上层印制板通过裸芯片微组装工艺实现高密度集成,下层采用表贴封装器件降低加工复杂度。测试结果表明,各项指标均满足设计要求。通过结构分层与工艺融合,组件在紧凑空间内实现了高隔离特性。

【Abstract】 This paper presents the design of a miniaturized power dividing and amplifying module suitable for the L-band. The module achieves six-way signal distribution through a cascaded one-to-two power divider,combined with low-noise amplifiers, filters, and switching circuits, thereby fulfilling the functions of power division and amplification for antenna-received signals while optimizing radio frequency(RF) performance.Through processes such as design specification analysis, component selection, and simulation calculations, the architectural design of the module was determined. The design adopts a multi-layer PCB layout and a hybrid process architecture, with the upper layer utilizing bare-chip microassembly technology to achieve high-density integration, and the lower layer employing surface-mount devices to reduce manufacturing complexity. Test results demonstrate that all performance metrics meet the design requirements. By integrating structural layering and process fusion, the module achieves high isolation characteristics within a compact space.

  • 【会议录名称】 2025年全国微波毫米波会议报告集-WA1T
  • 【会议名称】2025年全国微波毫米波会议(2025年中国微波周)
  • 【会议时间】2025-05-19
  • 【会议地点】中国陕西西安
  • 【分类号】TN722
  • 【主办单位】中国电子学会
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