【作者】 任朝炜； 王志刚；

【Author】 Chaowei Ren;Zhigang Wang;Fundamental Science on EHF Laboratory, University of Electronic Science and Technology of China;

【机构】 电子科技大学极高频复杂系统国防重点学科实验室；

【摘要】 微波组件的气密性封装可以确保组件内部与外界环境隔绝,是提高组件可靠性行之有效的方法之一。本文采用HFSS仿真和优化设计了一种微带到矩形波导的垂直过渡结构,该结构具有低损耗和高气密性。对于基于HTCC工艺的T/R组件的设计和测试,该结构具有重要的工程价值。更多还原

【Abstract】 The air-tight packaging of microwave module can ensure the isolation of the internal and external environment of the module, which is one of the effective methods to improve the reliability of the module. In this paper, a vertical transition structure from microstrip to rectangular waveguide is designed by HFSS simulation and optimization, which has low loss and high air tightness. This structure has important engineering value for the design and test of T/R module based on HTCC.更多还原