【作者】 周礼； 唐旻； 张跃平； 毛军发；

【Author】 ZHOU Li;TANG Min;ZHANGYueping;MAO Junfa;Key Laboratory of Ministry of Education for Research of Design and Electromagnetic Compatibility of High Speed Electronic Systems,Shanghai Jiao Tong University;

【机构】 上海交通大学教育部高速电子系统设计与电磁兼容研究重点实验室；

【摘要】 本文设计了一种基于3D打印技术的散热增强型Vivaldi天线阵列结构。天线单元采用基片集成波导(SIW)的纵向缝隙馈电,以此取代传统Vivaldi天线中的巴伦馈电结构。基于电热协同设计方案,在Vivaldi天线两侧设计了鳍状结构。该鳍状结构不但可以有效提高天线的增益,同时进一步增强了整体结构的散热能力。通过实验测试,天线阵列具有28.8%(21.63～28.83 GHz)的阻抗带宽和13.4～15.5 dBi的增益范围,该设计在5G毫米波系统中具有重要的应用潜力。更多还原

【Abstract】 In this paper,a new type of Vivaldi antenna with heat dissipation enhancement is proposed and manufactured based on three-dimensional(3-D) printing technology.A longitudinal slot on substrate integrated waveguide(SIW) is employed to feed Vivaldi radiation structure,which replaces the balun structure of traditional Vivaldi antennas.Based on the idea of electro-thermal co-design,a fin structure is designed on both sides of Vivaldi antenna.The fin structure in the antenna array can not only effectively increase the gain of the antenna,but also further enhance the heat dissipation capacity of the overall structure.Through experimental tests,the antenna array has an impedance bandwidth of 28.8%(21.63～28.83 GHz) and a gain range of 13.4～15.5 dBi.This design has important application potential in 5 G millimeter-wave systems.更多还原