【作者】 杨晓； 黄银山； 张成瑞； 周亮； 毛军发；

【Author】 Xiao Yang;Yinshan Huang;Liang Zhou;Chengrui Zhang;Junfa Mao;Shanghai Jiao Tong University;

【机构】 上海交通大学；

【摘要】 本文介绍了一种采用硅基MEMs光敏复合薄膜多层布线工艺,实现的W波段三维异质集成雷达前端收发组件。该组件高密度集成了硅基锁相环芯片、Si Ge收发芯片和Ga N功率放大芯片,通过天线馈网过渡结构与高增益天线实现了互连,前端收发组件尺寸为6×4×1cm,重量仅为81克。其发射功率在94GHz处为22 dBm,接收增益约18 dB,噪声系数10 dB。对基于异质集成收发前端FMCW雷达的测距实验表明,该异质集成雷达前端具有较高的分辨率、较好的接收和发射隔离度,实现了雷达收发前端的高性能与小型化。更多还原

【Abstract】 This paper presents a W-band 3 D-heterogeneous integration transceiver Front-end based on MEMs photosensitive composite film multilayer wiring process of Silicon-based. The GaN power amplifier chip, SiGe transceiver chip and Silicon-based PLL are high density integrated in this module. Design of a novel transition feeder connecting module with antenna, the whole system is 6×4×1 cm, 81 g. On-wafer measured transmitting power is 22 dBm at 94 GHz.Receiver gain is about 18 dB, and noise figure is about 10 dB. The measured results show that this module has high detection resolution, high TX-RX isolation. And the radar front-end achieves high performance and miniaturization.更多还原