高CAF可靠性Tg150℃覆铜板的开发

【作者】 方克洪； 潘子洲；

【Author】 Kehong Fang;Zizhou Pan;

【机构】 国家电子电路基材工程技术研究中心广东生益科技股份有限公司；

【摘要】 针对传统无铅用Tg150覆铜板在CAF性能上的局限性,本文通过对CAF成因的分析与研究,从树脂材料增韧、玻纤布浸润性及板材吸水性等入手,开发出一种新型中Tg高CAF可靠性的覆铜板材料,板材不仅具有良好的耐热性和PCB加工性,而且板材加工最小孔壁间距缩至0.3mm时仍具备出色的CAF可靠性。更多还原

【Abstract】 Due to the limitations of traditional lead-free Tg150 copper clad laminates in CAF performance, the cause of affecting CAF was analyzed and studied in this article. Through the improvement of resin material toughness, glass fiber cloth wettability and board water absorption, etc., a new type of copper clad laminate with middle Tg and high CAF reliability has been developed. The Laminate not only has good heat resistance and PCB processability, but also has excellent CAF reliability when the minimum hole wall to wall spacing is reduced to 0.3 mm.更多还原