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一种复合信息读出的像素读出芯片及其抗辐照测试结果

A pixel chip with compact information readout capability and its radiation hardness test results

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【作者】 魏微樊磊任佳义崔珊珊张杰王铮江晓山朱科军刘鹏

【Author】 Wei Wei;Lei Fan;Jiayi Ren;Shanshan Cui;Jie Zhang;Zheng Wang;Xiaoshan Jiang;Kejun Zhu;Peng Liu;Institute of High Energy Physics, Chinese Academy of Sciences;State Key Laboratory of Particle Detection and Electronics;University of Chinese Academy of Sciences;

【机构】 中国科学院高能物理研究所核探测与核电子学国家重点实验室中国科学院大学

【摘要】 即将在北京建设的高能同步辐射光源将实现世界上亮度最高的光源之一,并计划建设90条以上的高性能光束线站。与光源的高性能相对应,探测器当前已经逐渐成为开展高质量用户实验的瓶颈之一。先进的二维X射线像素阵列探测器已实现了探测器性能的大幅提升,然而未来线站对事例时间、能量信息的获取提出了更高的要求。本文提出了一种基于事例驱动型读出的像素读出芯片,可以有效减少同一像素的事例读出死时间,从而实现对传感器接收光子的连续探测与读出。在每个像素中还可同时探测击中事例的到达时间以及粒子能量,再加上像素给出的位置信息,从而实现对事例信息的无损探测。通过事例重建,可以完全重建物理过程,非常适合对稀疏事例的高速动态过程观测。本文介绍了像素读出芯片的设计,并详细介绍了芯片的测试,特别是抗辐照测试结果。

【Abstract】 The High Energy Photon Source(HEPS) that will be built in Beijing will implement a light source with the highest luminosity worldwide. Over 90 high performance beamlines are also scheduled within the facility. However, despite of the high performance of the light source, detectors are more and more becoming bottlenecks of carrying out high quality user experiments. Advanced 2-D X-ray silicon pixel detectors have greatly promote the performance of beamlines detectors, however, higher requirements of detecting event timing and energy information are needed for future beamlines. This paper proposed a pixel readout chip that is based on Event-Driven readout scheme. This can effectively decrease the event readout deadtime in the same pixel, so as to achieve continuous detection and readout of the detector hit photons. In each pixel, the arrival time of the hit event and its energy can be detected at the same time, in addition with the position information given by the pixel location, so that a lossless detection can be performed. After the event rebuilding, the physical procedures can be fully reconstructed, making it very suitable for the high speed dynamic observation to the sparse events. This paper introduces the pixel readout chip design, and details the chip measurement, especially its radiation hardness test results.

【基金】 基金委重点课题(项目号11235013);国家重点研发计划(项目号2016YFA0401300)的资助
  • 【会议录名称】 第十九届全国核电子学与核探测技术学术年会论文集
  • 【会议名称】第十九届全国核电子学与核探测技术学术年会
  • 【会议时间】2018-10-15
  • 【会议地点】中国湖南衡阳
  • 【分类号】TL81
  • 【主办单位】中国核学会核电子学与核探测技术分会
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