【作者】 杨富国； 陈文静； 董少锋； 朱琼霞； 陈忻；

【Author】 YANG Fu-guo;CHEN Wen-jing;DONG Shao-feng;ZHU xiong-xia;CHEN Xin;Foshan University;College of Chemistry and Material Science,Anhui Normal University;

【机构】 佛山科学技术学院环境与化学工程学院； 安徽师范大学化学与材料科学学院；

【摘要】 为了节约镍资源,开发了一种无镍白色锡-钴合金电镀工艺,采用焦磷酸盐体系并添加光亮剂直接在铜片表面进行锡-钴合金电镀。探讨了电镀时间及电流密度对镀层外观、镀液稳定性的影响,确定了其最佳工艺参数:200 g/L焦磷酸钾,20 g/L硫酸亚锡,20 g/L硫酸钴,5 g/L光亮剂,温度55℃,pH值8.7,电流密度0.5 A/dm～2,施镀时间2.5 min。在该工艺条件下,锡钴合金镀层中锡含量为80.54%。用原子吸收光谱仪测定金属离子浓度,用金相显微镜测定其厚度,并对样品进行了弯曲试验、热浸试验、人工汗试验、高温变色的测定。更多还原

【Abstract】 To conserve nickel resources,brighteners were introduced into Sn-Co alloy electroplating on copper sheets and a process for nickel-free gun color Sn-Co alloy electroplatingon copper was established.The effects of platingtime,and current density on coating appearance and bath stability were investigated;and the optimal electroplating parameterswere established.Results show that the plating bath has an optimal composition of 20 g/L stannous sulfate,20 g/Lcobalt sulphate,5 g/Lbrightener,and the optimal electroplating parametersare suggested as bath temperature of 55℃ and bath pHvalue of 8.7 as well as current density of 0.5 A/dm2 and platingtime of 2.5 min.Concentration of metal ion was determind by means of atom absorbed spectrometer.Thickness was determined by means of metalloscope.Bend test,heat immersion test and artificial sweat test were done for sample.更多还原