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巯基乙酸钠对铜表面点击组装缓蚀膜的复配增效

Synergistic Effect of Sodium Thioglycolate on Corrosion Inhibitor Film with Clicking Assembly on Copper Surface

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【作者】 张凯施成张大全高立新

【Author】 ZHANG Kai;SHI Cheng;ZHANG Daquan;GAO Lixin;Shanghai Key Laboratory of Materials Protection and Advanced Materials in Electric Power,Shanghai University of Electric Power;School of Environmental and Chemical Engineering,Shanghai University of Electric Power;

【机构】 上海电力学院上海市电力材料防护与新材料重点实验室上海电力学院环境与化学工程学院

【摘要】 以对甲苯磺酰叠氮(TA)和3-丁炔-1-醇(BTO)作为铜表面点击组装的反应物,在铜组装液中加入微量巯基乙酸钠(STG)以增强点击组装缓蚀膜的缓蚀率。利用电化学阻抗谱(EIS)和极化曲线检测组装膜的缓蚀率,采用原子力显微镜(AFM)、扫描电子显微镜(SEM)等表面分析方法对材料表面进行表征分析。结果表明,TA和BTO在铜表面发生点击反应形成一层三唑类缓蚀膜,STG的加入大大提高了缓蚀膜的保护作用,复合组装膜主要抑制腐蚀的阳极反应过程,是阳极型缓蚀剂。对复合组装膜的复配增效缓蚀机理进行了研究分析。

【Abstract】 Using p-toluenesulfonyl azide(TA) and 3-butyn-1-ol(BTO) as the reactants of click-assembly on the copper surface,a small amount of sodium thioglycolate(STG) was added to the assembly solution in order to enhance the protection of the click-assembly film.The protection was detected by electrochemical impedance spectroscopy(EIS) and polarization curves.The material surface was analyzed by atomic force microscope(AFM),scanning electron microscope(SEM) and other surface analysis methods.The results show that the click-assembling film of triazole formed on the copper surface.The addition of STG greatly improved the corrosion inhibition rate of the inhibitor,and the complex film mainly inhibited the anodic reaction process of corrosion.The synergistic inhibition mechanism of STG had been discussed.

  • 【会议录名称】 第二十届全国缓蚀剂学术讨论会论文集
  • 【会议名称】第二十届全国缓蚀剂学术讨论及应用技术经验交流会
  • 【会议时间】2018-07-24
  • 【会议地点】中国湖北武汉
  • 【分类号】TG174.4
  • 【主办单位】中国腐蚀与防护学会缓蚀剂专业委员会
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