【作者】 高亮； 魏兴昌；

【Author】 Liang Gao;Xing-Chang Wei;College of Information Science and Electronic Engineering, Zhejiang University of China;

【机构】 浙江大学信息与电子工程学院；

【摘要】 本文研究了硅通孔(TSV)转接板内重新布线层(RDL)互连的传输特性。针对常用的地-信号(GS)和地-信号-地(GSG)互连结构,分析了各因素(硅衬底损耗、频率、尺寸等)对其传输特性的影响。然后根据仿真结果提取描述互连插入损耗的经验公式,体现了互连插入损耗与各参数之间的关系。结果表明,经验公式与全波仿真数据在实际工艺参数范围内吻合良好,验证了经验公式的可靠性。更多还原

【Abstract】 In this paper, an empirical formula for transmission characteristics of redistribution layer(RDL) on through silicon via(TSV) interposer is presented. The Ground-Signal-Ground(GSG) structure in RDL is built to scan the parameters that have an effect on transmission. According to the simulation results, the expression of an empirical formula can be extracted and fitted by a set of simulated data, which relates the insertion loss and the parameters. The result shows that the presented empirical formula is in good agreement with the simulated data within the scope of the simulation, which verifies the reliability.更多还原