【作者】 张秀萍； 欧阳家虎； 刘占国； 王玉金；

【Author】 ZHANG Xiuping;OUYANG Jiahu;LIU Zhanguo;WANG Yujin;School of Materials Science and Engineering,Harbin Institute of Technology;

【机构】 哈尔滨工业大学材料科学与工程学院；

【摘要】 本文在TZ3Y20A基体中添加SiC颗粒,通过热压烧结法制备了致密的复相陶瓷。通过压痕法在材料表面引入微裂纹,经高温热处理研究裂纹的自愈合性能。结果表明,TZ3Y20A-SiC陶瓷经高温热处理后微裂纹能完全愈合,在1073K、1273K和1373K等愈合温度下完全愈合裂纹所需的时间分别为30 h、10 h和5 h。裂纹自愈合机制为复相陶瓷中SiC颗粒在高温空气中发生氧化反应,生成的氧化物SiO₂填真补裂纹空隙,使强度得到完全恢复。更多还原

【Abstract】 TZ3Y20A ceramics incorporated with β-SiC have been prepared by hot pressing to form dense bulk ceramic.Microcracks were introduced by the indentation method,and the crack-healing behavior of TZ3Y20A-10 vol%SiC ceramics has been investigated by high-temperature oxidation.Heat treatment in air enhances distinctly the flexural strength of TZ3Y20A-SiC ceramics.A complete crack-healing of TZ3Y20A-SiC ceramic can be realized by optional heat treatments at 1073 K for 30 h,1273 K for 10 h or 1373 K for5 h,respectively.The crack-healing mechanism is attributed to the formation of SiO₂ caused by high temperature oxidation during heat treatment,which fills in the cracks and recovers the flexural strength.更多还原