【作者】 贲志红； 李跃华； 杨敏； 万晶； 刘宇辙；

【Author】 BEN Zhi-hong;LI Yue-hua;YANG Min;WAN Jing;LIU Yu-zhe;Nanjing University of Science and Technology;Institute of Microelectronics of Chinese Academy of Science;

【机构】 南京理工大学； 中国科学院微电子研究所；

【摘要】 针对射频微波集成电路调试过程工作量庞大且复杂,过孔以及无源器件寄生效应影响明显的特点,本文基于微波功率放大器的阻抗匹配调试过程,提出一种新型的芯片-板级一体化联合建模设计方法。将功率放大器板级模块在HFSS中还原建模,并结合ADS对其S参数提取以及联合仿真,通过在软件中进行阻抗匹配得到最佳输出功率和最大增益。此方法考虑了过孔以及寄生效应带来的影响,可运用于PCB级以及系统级封装等模块的调试与验证,不仅大大的缩短了模块板级调试的周期,而且提高了电路设计的精度,进而加快了芯片设计的进度。更多还原

【Abstract】 Against the effective of via hole and parasitic effects of passive device,debugging of RF and microwave integrated circuit has been a very complex process that needs a large amount of work.This paper proposes a novel way to model and design die-PCB broad as a whole during the phase of making impedance match of power amplifier,we model the PCB board of PA with HFSS at first.then extract and simulate S-parameter with ADS.That is to say,we can make to get the optimal output power and gain by impedance matching with soft.Taking the effective of via hole and parasitic effects into account,this way can be well adapted to testing and verifying PCB and system-in-package,which not only improves the accuracy of circuit designing but the period of debugging can be greatly shorten,therefore accelerates the pace of RFIC design.更多还原