【作者】 谢文涛； 祁宏庆； 戴斌； 任路超； 罗现福； 顾玥； 周洪庆；

【Author】 Xie Wentao;Qi Hongqing;Dai Bing;Ren Luchao;Luo Xianfu;Gu Yue;Zhou Hongqin;Center of Microwave Materials, Nanjing Tech University of China;Nanjing Guigong Electric-tech,LTD of China;

【机构】 南京工业大学微波材料中心； 南京硅工电子科技有限公司；

【摘要】 本文围绕微波毫米波复合介质材料与电路系列基板、新型高Q微波陶瓷系列介质与元器件、宽频高密度无源集成封装用低温共烧陶瓷及其生瓷料带关键基础材料的研究开发成果,结合三大类微波新材料批量稳定制备与工艺参数的优化,综述了材料微观结构与微波性能之间的关系规律。为雷达、通信、卫星等高频微波毫米波设计师们提供有益帮助奠定基础。更多还原

【Abstract】 In this paper, findings of Microwave-millimeter-wave dielectrics and circuit substrates,, high Q microwave ceramics and components and high density passive integrated packaging at low temperature co-fired ceramics and green tape are presented. Relationships between microstructure and microwave properties of materials were reviewed of the three kinds of material in terms of microwave quality steady preparation and process optimization. It is basic to provide useful help for high frequency microwave- millimeter wave designers.更多还原