【作者】 付璇； 鲍婕； 黄时荣； 王楠； 袁志超； 张燕； 路秀真； 叶丽蕾； 刘建影；

【Author】 FU Xuan;Bao Jie;Huang Shirong;Wan Nan;Yuan Zhichao;Zhang Yan;Lu Xiuzheng;Ye Lilei;Liu Johan;SMIT Center,School of Mechatronics Engineering and Automation,Shanghai University & Key Laboratory of Advanced Display and system integration,Ministry of Education;SHT Smart High Tech AB,Aschebergsgatan 46 Se 411 33,Gothenburg,Sweden;Bionano System Laboratory,Dept of Microtechnology and Nanoscience,Chalmers University of Technology,Se 412 96 Gothenburg,Sweden;

【机构】 上海大学机电工程与自动化学院中瑞微系统集成技术中心&教育部新型显示和系统集成重点实验室； SHT Smart High Tech AB,Aschebergsgatan 46 Se 411 33,Gothenburg,Sweden； Bionano System Laboratory,Dept of Microtechnology and Nanoscience,Chalmers University of Technology,Se 412 96 Gothenburg,Sweden；

【摘要】 随着半导体技术的迅速发展,器件的集成度越来越高。功率密度越来越高,热点温度也越来越高,微电子器件热管理问题越来越突出,因此,开发一种具有高导热性能的导热胶材料具有重要现实意义。本文中,介绍了一种新型导热胶,该导热胶填充了负载了具有良好导热性的银颗粒的氮化硼薄膜,能极大地提高导热胶的散热性能。首先,通过液相剥离的方法从氮化硼粉末中剥离出二维层状的氮化硼薄膜,然后通过以硝酸银为基本的反应物得出纳米银颗粒,最后通过超声手段将其纳米银颗粒负载到薄膜上形成特殊的金属氮化硼薄膜混合物。通过一系列表征方式如TEM,AFM可以观察这种混合物的结构。这种导热胶是一种常见的胶体,其主要由环氧聚合物和微米银组成。它的温度特性通过导热系数测定仪测量,伴随着填充物的增加,其导热系数也会逐渐提高。当填充物在导热胶中所占的质量分数为2.7%时其导热系数提高到3.55W/m·k,与没有填充物的导热胶相比导热系数提高20%,这对提高导热胶性能具有重要的意义,同时,实验结果通过仿真手段也得到了验证。更多还原

【Abstract】 With the rapid development of semiconductor technology,the packaging density of electronic products become higher and higher.The high temperature generated by the increasing power density make the thermal management of microelectronic devices crucial.Therefore,development of high thermal conductivity Adhesives(TCAs) is of great importance.In this paper,a novel functionalized 2D layer Boron Nitride enhanced TCA has been developed.2D layer Boron Nitride was prepared by chemical exfoliation and functionalized with a nano-silver particles(average size is ten nanometer)to obtain a special BN/Ag hybrid material.Moreover,TEM,AFM were applied to characterize the homogeneous component structure.The base material is a traditional TCA which is composed with epoxy matrix and micro-sized Ag flakes.Thermal characterization result indicates that a significant thermal conductivity improvement was achieved through adding BN/Ag into the material.The result shows a thermal conductivity value is 3.55W/m·k when the BN/Ag filling percentage is 2.7% which is more than 20 percent improvement compared to the case without the BN/Ag filling.Meanwhile,The thermal conductivity result is compared with the FEM simulation.The simulation agrees well with the experimental results.更多还原