【作者】 杜宝亮； 尹凤福； 周晓东； 李玉祥； 李洪涛； 张西华；

【Author】 Du Baoliang;Yin Fengfu;Zhou Xiaodong;Li Yuxiang;Li Hongtao;Zhang Xihua;State Key Laboratory of Haier Digital Household Appliances;Institute of Process Engineering,Chinese Academy of Sciences;

【机构】 海尔数字化家电国家重点实验室； 中国科学院过程工程研究所；

【摘要】 通过开展无铅波峰焊正交试验,以大量的试验数据为依据确定了无铅电子组装工艺参数,建立了无铅波峰焊工艺参数间的关系模型,考察了不同试验因素的组合对焊点缺陷率的影响,对工艺参数进行了优化,并得到了各因素对实验结果重要性的影响顺序及优化的参数结果。更多还原

【Abstract】 An orthogonal experiment of lead-free wave soldering was conducted,then the process parameters of the lead-free electronic assembly were confirmed on the basis of a large number of experimental data,the model of the relationship between the lead-free wave soldering process parameters was established,the influence of solder defect rate by combined collocation(interaction) between the experimental factors was investigated,the process parameters were optimized.Optimized parameters results and the order of importance of various factors on the experimental results were obtained.更多还原