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铜应力缓解层对陶瓷-金属连接残余应力的影响

The Influence of Cu Buffer Layer on the Residual Stress of a Ceramic-Metal Joint

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【作者】 张小勇楚建新叶军陆艳杰刘鑫

【Author】 ZHANG Xiao-yong, CHU Jian-xin, YE Jun, LU Yan-jie, LIU Xin (Beijing General Research Institute for Nonferrous Metals , Beijing 100088, China)

【机构】 北京有色金属研究总院

【摘要】 用有限元法计算了不同厚度铜片对Si3N4-4Cr10Si2Mo连接四点弯曲试样残余应力的影响,找出最大残余应力位置及数值。测量了不同厚度铜片作缓解层时连接试样强度。计算结果与测量结果一致性较好。当铜片厚度为0.3 mm时,连接试样残余应力最小,连接强度最高。

【Abstract】 The influence of various copper foil thickness on the residual stress of the Si3N4-4Cr10Si2Mo joint was calculated by using finite element method. The position and value of the maximum residual stress were obtained. The joint strengths for different copper buffer layers were experimentally measured. The calculated and measured results are in good agreement. When the copper foil is 0.3 mm thick, the residual stress of joints reaches the minimum, resulting in the maximum joint strength.

  • 【会议录名称】 电子陶瓷,陶瓷,金属封接与真空开头管用管壳的技术进步专辑
  • 【会议时间】2006-04
  • 【分类号】TG457
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