【作者】 章林； 曲选辉； 段柏华； 何新波；

【Author】 ZHANG Lin QU Xuanhui Duan Bohu He Xinbo (School of Materials Science and Engineering,University of Science and Technology Beijing,Belting I00083,China)

【机构】 北京科技大学材料科学与工程学院；

【摘要】 以化学镀 Cu 包 SiC 粉末和高压氢还原法制备的 Ni 包 SiC 复合粉末为原料,用放电等离子体烧结法制备了 SiC/Cu 复合材料。分析了增强相含量和烧结温度对致密化的影响,比较了非包覆粉末和包覆粉末制备的复合材料的界面结合状况,然后对 SiC/Cu 复合材料的热膨胀行为和力学性能进行了研究。结果表明:包覆粉末能够促进材料的致密化并且能获得良好的界面结合,所得 SiC/Cu 复合材料的致密度达96.7%,抗压强度达1061MPa。SiC/Cu 复合材料的热膨胀系数介于7.5～11.4×10^-6/K 之间,并且随 SiC 体积分数的增加而降低。材料在热循环过程中山现热滞现象,热滞现象受增强相的含量及界面结合状况的影响。更多还原

【Abstract】 Cu-coated SiC and Ni-coated SiC Powder was used as raw material,Cu-coated SiC powder was produced by electroless plating. Ni-coated SiC Powder was prepared by hydrogen reduction under high pressure.Spark Plasma Sintering（SPS）was applied to prepare SiC/Cu composites.The densification behavior,the effects of coated powder on the microstructure,the thermal expansion behavior and the mechanical properties were studied.From these results,it can be concluded that the densification was improved by using coated powder and the bonding strength of the interface was enhanced.The relative density was 96.7% and compressive strength reached 1012MPa。CTE of SiC/Cu composites ranged between 7.5～11.4× 10^-6/K and decreased with increasing SiC content. Thermal hysteresis phenomenon emerged during the thermal cycling and influenced by the reinforcement content and the interfacial bonding strength.更多还原