【作者】 修子扬； 武高辉； 宋美慧； 朱德志；

【Author】 XIU Zi-yang, WU Gao-hui, SONG Mei-hui, ZHU De-zhi (School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China)

【机构】 哈尔滨工业大学材料科学与工程学院；

【摘要】 采用挤压铸造专利技术制备了Sip/LG5、Sip/LD11、Sip/Al-Si20 3种可回收再利用的高体积分数环保型复合材料,探讨了温度及复合材料中Si元素总含量对复合材料热物理性能的影响规律。结果表明:常温下Sip/Al 复合材料热膨胀系数最低可达7.5×10-6/℃,热导率大干126 W/(m·℃),最高可达157.9 W/(m·℃),是一种优异的低膨胀、高导热复合材料;随着温度的升高,复合材料比定压热容和热膨胀系数逐渐增大,热扩散系数和热导率逐渐降低;随着复合材料中Si元素总量的增加,复合材料的定比压热容、热膨胀系数、热扩散系数和热导率均逐渐降低;热导率测试值低于理论计算值;Si-Al之间存在界面热阻,界面热阻值为0.01×10-6m2·℃/W。更多还原

【Abstract】 Three high volume fraction Sip/LG5,Sip/LD11 and Sip/Al-Si20 environment protection composites reclaimed were fabricated by patented squeezing cast method. The effects of temperature and total Si content on the thermophysical properties of three composites were investigated. The results show that the composites have a low coefficient of thermal expansion (7.5×10-6/℃) and high thermal conductivity (157.9W/(m·℃)). With the increase of temperature, the specific capacity and the average coefficient of thermal expansion increase monotonically, the coefficient of thermal diffusion and the thermal conductivity decrease gradually. The specific capacity, the average coefficient of thermal expansion, the coefficient of thermal diffusion and the thermal conductivity of the composites decrease gradually with increasing Si content. The thermal conductivities tested are lower than those calculated. The interface thermal resistance exist in the silicon and aluminum with a value of 0. 01×10-6 m2 ℃/W.更多还原