【作者】 汤玉琼； 周铁涛； 刘培英；

【Author】 TANG Yu-qiong, ZHOU Tie-tao, LIU Pei-ying (School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China)

【机构】 北京航空航天大学材料科学与工程学院；

【摘要】 采用X射线衍射技术(XRD)及拉伸实验对7055及高铜实验合金的力学性能进行丁研究。X射线衍射结果表明:经过固溶时效工艺过程后,高铜实验合金中有大量S(Al2CuMg)相析出,而7055合金仅有少量S相析出;同一热处理工艺条件下,铜含量的增加能提高合金的强度,但延伸率有所降低。350℃,1 h和450℃,1h固溶、水淬,120℃,24 h时效后高铜实验合金的抗拉强度为584 MPa,而7055合金的抗拉强度仅为560 MPa。研究认为高铜实验合金抗拉强度的提高是S相强化的结果。更多还原

【Abstract】 The microstructure and mechanical properties of 7055 aluminum alloy and high copper content alloy were studied by X-ray diffracrometry (XRD) and tensile test. The XRD analysis result shows that much S-phase (Al2CuMg) was precipitated from the high copper content alloy while only in the 7055 alloy. Tensile stress of Al alloy increases through improving copper contents while elongation decreases during the same heat treatment process. The tensile stress of high copper content alloy is 584 MPa while that of 7055 alloy is 560 MPa after 350 ℃ 1 h and 450 ℃ 1 h solution and water quenching, then aging at 120 ℃ for 24 h. It is considered that S-phase can improve the tensile stress of high-Cu experiment alloy.更多还原