【作者】 冯晓国； 张景和； 张承嘉； 何惠阳；

【Author】 Feng Xiaoguo Zhang Jinghe Zhang Chengjia He Huiyang(Changchun Institute of Optics and Fine Mechanics and Physics, Chinese Academy of Sciences, Changchun 130021, China)

【机构】 中国科学院长春光学精密机械与物理研究所；

【摘要】 划片是集成电路(IC)后封装中的第一道工序,其加工质量将直接影响整个生产线的整体质量。本文介绍了中科院长春光机所自行研制的划片机的研制过程。重点阐述了总体机构设计、主要分系统设计和设备的最终检测结果。结果表明,设备主要性能指标已达到了国际20世纪90年代中期水平。更多还原

【Abstract】 Wafer incision is the first crucial working procedure during integrate circuit offspring encapsulation, its quality will have a strong impact on whole quality of product line. The paper introduces development of wafer incision machine made by Changchun Institute of Optics and Fine Mechanics and Physics. It importantly expatiates on the design of overall framework, the design of mainly subsystem and measuring results. The results testify that the machine’s performance achieves metaphase level of ninety age in abroad.更多还原