【作者】 李云振； 王从曾； 张连宝； 苏学宽； 马捷；

【Author】 LI Yun-zheng, WANG Cong-zeng, ZHANG Lian-bao, SU Xue-kuan, MA Jie School of Material Science and Engineering, Beijing University of technology, Beijing, 100022, China

【机构】 北京工业大学 材料科学与工程学院；

【摘要】 采用空心阴极等离子烧结工艺,实现对铁基粉末的高温、快速烧结,同时引入渗金属工艺。结果表明:显微组织分析可以显示在不同的工艺参数条件下烧结体的致密化过程;在烧结过程中, 粉末制品的致密度随着输出功率和烧结时间的增加而增加;通过空心阴极的溅射作用,在烧结体表面能够形成完整的钨渗层;且渗层厚度随着阴极电压和气压的升高而增加,随着保温时间的增长, 渗层不断加厚。更多还原

【Abstract】 By hollow cathode plasma sintering process, high temperature and fast sintering was implemented, at the same time alloying process was introduced. The results show that microstructure analysis can reveal densification process on the condition of diverse parameters. In the process of sintering, the density of powder products will increase with the increasing of output power and sintering time. By splashing of hollow cathode, whole tungsten alloying layer can be formed on the surface. Furthermore, the thickness of layer will increase with the increasing of cathode voltage and gas pressure, the layer continuously become thick with the increasing of the heat preservation time.更多还原