【作者】 朱学林； 郭育华； 王俊； 刘刚； 阚娅； 田扬超；

【Author】 Zhu Xuelin Guo Yuhua Wang Jun Liu Gang Kan Ya Tian YangchaoNational Synchrotron Radiation Laboratory, University of Science and Technology of China, Hefei, 230029

【机构】 中国科学技术大学国家同步辐射实验室；

【摘要】 研究了PMMA热压键合工艺,测量了PMMA的键合强度,利用扫描电镜检测了键合后微流体管道的结构变化,讨论了键合温度、键合压力等因素对键合强度的影响;给出了热压键合的合理工艺参数范围。结果表明,经过参数优化后的热压键合法可以满足PMMA微流体器件对键合的需求。更多还原

【Abstract】 The thermal bonding of PMMA was studied. The bond strength of PMMA was measured by MTS-809 system. The bonded micro - channel was evaluated by SEM. The effects of bonding temperature and bonding pressure were discussed and then proper bonding parameters were given. The results indicate that these optimized bonding parameters can meet the demands of micro -fluidic devices.更多还原