【作者】 戚丽娜； 许高斌；

【Author】 Qi Lina Xu Gaobin Key Laboratory of MEMS of Ministry of Education, Southeast University, Nanjing, 210096

【机构】 东南大学MEMS教育部重点实验室；

【摘要】 目前已经有用桥式结构来测试薄膜的热扩散率,在此基础上把辐射、对流、对衬底的传热等环境影响都考虑进去,使得该模型在使用中更符合实际情况,更有实际意义。利用两根不同长度的梁,以相同的电流对其加热,分析其瞬态特性,即可获得多晶硅薄膜的热扩散率。用有限元分析软件ANSYS进行了模拟分析,分析表明模拟结果与理论结果趋势一致,数值吻合,从而验证了模型建立的正确性,说明该方法能够实现对多晶硅薄膜的测量,且具有较高的测试精确度。更多还原

【Abstract】 The radiant heat loss and the convective heat loss from the structure had been considered into the bridge test structure to measure the diffusivity of polysilicon thin films. This model was fitted to the actual test conditions. Same heating constant current was applied in the two beams, with same width and thickness but variant length, up to thermal steady state, and the changes of resistance with time must be measured using a separation circuit, then thermal diffusivity can be obtained. Finite element software ANSYS was used to verify the design and the electrothermal model.更多还原