【作者】 陈伟平； 张丹； 刘晓为； 揣荣岩；

【Author】 Chen Weiping Zhang Dan Liu Xiaowei Chuai Rongyan Harbin Institute of Technology,Harbin, 150001Heilongjiang University,Harbin, 150080 Shenyang University of Technology,Shenyang, 110023

【机构】 哈尔滨工业大学；

【摘要】 介绍了静电键合工艺仿真模型及其过程仿真,对平板电极、单点电极、多点电极的键合电流和键合进程进行了建模,采用动态工艺数据库方法完成了三种静电键合工艺下的可视化编程,实现了静电键合过程的可视化仿真与工艺CAD。更多还原

【Abstract】 Modeling methods for anodic bonding process and simulation were introduced. Models were set up to simulate bonding currents and bonding process with planar cathode. single pin cathode, multi pin cathodes. Visual program on anodic bonding process was accomplished based on dynamic database and three modes. Simulation for general anodic bonding process and MEMS technical CAD are realized.更多还原