【作者】 曾欢欢； 赵湛； 王奇； 方震； 张博军；

【Author】 Zeng Huanhuan Zhao Zhan Wang Qi Fang Zhen Zhang BojunState Key Lab of Transducers Technology,Chinese Academy of Sciences,Beijing, 100080Graduate School, Chinese Academy of Sciences,Beijing, 100039

【机构】 中国科学院电子学研究所传感技术国家重点实验室；

【摘要】 聚酰亚胺(PI)电容式湿度传感器的新型设计简化了工艺流程,避免引线台阶式引出时可能出现的脱落、断裂等问题;改进了温度补偿电极的位置及结构;分析了平板式电容式传感器的等效电路及简化条件,以及PI薄膜的厚度与亚胺化温度对吸湿性能的影响。研究了反应离子刻蚀(RIE)对完成电极腐蚀后的芯片进行高选择比的各向异性刻蚀及时温度响应的影响,结果表明增大了PI与周围环境的接触面积,提高了响应速度。更多还原

【Abstract】 A novel design was presented in this paper. First,the upper down-leads were cancelled to simplify the fabrication techniques, and the problems of broken-down were avoided when step out. Second, since improvements were made in the deposition and the structure of temperature compensation electrodes, they can be used to heat the polyimide vapor absorption layer meanwhile, such as to evaporate condensed vapour. Multilayer spinning polyimide with different thickness and spin speed were controlled to optimize performance of sensitivity. Besides, RIE provided high-ratio anisotropy ion etching for the wafer after electrodes patterning by a wet etch in mixed solution, in order to shorten the distance of vapor diffusing into polyimide between two capacitance electrodes and improve the response time constant.更多还原