【作者】 陈贤祥； 彭春荣； 白强； 陈绍凤； 夏善红；

【Author】 Chen Xianxiang Peng Chunrong Bai Qiang Chen Shaofeng Xia Shanhong State Key Laboratory of Transducer Technology, Insititute of Electronics,Chinese Academy of Sciences, Beijing, 100080 Graduate School of Chinese Academy of Sciences, Beijing, 100039

【机构】 中国科学院电子学研究所传感技术国家重点实验室；

【摘要】 提出了一种新型的热驱动微型电场传感器,该微型电场传感器采用MUMPs表面微细加工工艺加工,主要包括屏蔽电极、感应电极和热驱动结构三部分。其工作原理属于电荷感应式,用接地的屏蔽电极的用期运动来调制感应电极上在外部电场作用下感应的电荷,形成与外电场成正比的电流信号。用有限元法模拟了热驱动结构的驱动电压与温度、驱动位移和驱动力之间的关系,ANSYS模拟和理论计算结果表明,在±2V的驱动电压下,在实现数微牛驱动力的同时可以实现5.2μm的驱动位移.以1kHz的频率工作时,在10kV/m的外部电场强度下,感应电流超过400pA。更多还原

【Abstract】 A new type of thermally driven micro electric field sensor was proposed, it had advantages of low driving voltage, small volume, compact size, easy to integrate,and can be driven with standard CMOS circuits. The micro electric field sensor was mainly comprised of shielding electrodes, sense electrodes and thermal drive structure, and fabricated using MUMPs surface micromachining process. It was based on the charge induction principle, the shielding electrodes were used to modulate the induction charge by outer electric field on the surface of sense electrodes. Finite element method was used to simulate the relationship among driving voltage and temperature, drive displacement and drive force etc. The ANSYS simulation results point out the thermal driver can achieve 5. 2μm drive displacement and 6μN drive force at the working frequency of 1kHz. More than 400pA induction current can be achieved when the outer electric field intensity is 10kV/m.更多还原