【作者】 韦鹤； 王晓东； 刘冲； 廖俊峰；

【Author】 Wei He Wang Xiaodong Liu Chong Liao JunfengKey Lab for Precision and Non -traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116023

【机构】 大连理工大学精密与特种加工教育部重点实验室；

【摘要】 阐述了适合于塑料微流控芯片键合的超声波焊接的原理,设计了适用于微流控芯片的超声波焊接的两种导能筋,利用有限元软件模拟超声波焊接的过程,利用单元的“生死”和热焓法控制相变,计算出导能筋中温度场的分布情况,及微沟道在焊接过程中的变形情况。理论上验证了利用超声波焊接进行芯片键合的可行性。更多还原

【Abstract】 This paper presented a microfluidic chips bonding method based on ultrasonic welding. We proposed two kinds of energy -oriented -ridges suitable for the ultrasonic welding applied to microfluidic chips bonding. The welding process was simulated with finite element analysis software, by using "birth and death element" and the method of enthalpy to control the phase transformation. The temperature distribution of the energy -oriented -ridges and distortion of the micro -channel was analyzed. Simulation results show that the proposed ultrasonic welding method for microfluidic chips bonding is viable.更多还原