【作者】 李晶； 王晓强； 柯家骏； 范建峰； 袁章福；

【Author】 Li Jing, Wang Xiaoqiang, Ke Jiajun, Fan Jianfeng, Yuan Zhangfu (Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100080, China)

【机构】 中国科学院过程工程研究所；

【摘要】 用静滴法测量了熔融锡、铋及其二元合金的表面张力。分析了随温度和氧分压的不同,表面张力的变化情况。实验结果表明,在较低的氧分压情况下,熔融纯金属锡和铋的表面张力随温度的升高呈线性减小的关系;但在氧分压较高的情况下,它们的表面张力先随温度的升高而增加,然后随温度的升高而减小。根据热力学原理分析解释了实验结果。在特定氧分压的情况下测量了Sn-Bi(XBi=0．455) 合金的表面张力,其值随温度的升高有增加的趋势,并分析了导致此结果的原因。更多还原

【Abstract】 The surface tensions of molten Sn, Bi and their alloy (XBi=0.455) were measured by sessile drop method. The relationships between surface tension and temperature and oxygen partial pressure were investigated. The results show that at the lower oxygen partial pressures, the surface tensions of molten Sn and Bi decrease linearly with the increase of temperature, while their surface tensions increase firstly then decrease with the increase of temperature at higher oxygen partial pressures. The experimental results were analyzed based on thermodynamic theory. The surface tensions of Sn-Bi alloy were measured at determined oxygen partial pressure. The values had an increasing tendency with the increase of temperature, and the reasons were elucidated.更多还原