【作者】 陈兴旺； 徐晓明； 程树军； 王耀先；

【Author】 CHEN Xing-wang, XU Xiao-ming, CHENG Shu-jun,WANG Yao-xian (School of Material Science and Engineer ECUST,Shanghai 200237))

【机构】 华东理工大学材料科学与工程学院；

【摘要】 <正>信息技术领域的深入要求印刷电路板(PCB)向高频化发展,高性能PCB在介电性能、耐热性、耐湿热性、阻燃性等几项性能的要求上尤其重要。目前最常用的环氧、酚醛树脂由于上述几项性能处于劣势而不适合作为高性能PCB的原料。BMI树脂具有良好的耐高温、耐辐射、耐湿热、热膨胀系数小等优良特性;CE树脂具有良好的介电性能、力学性能、低收缩更多还原

【Abstract】 Modified bismaleimide triazine(M-BT) resin system based on different ratios of modified bismaleimide (BMI/DBA) resin and cyanate ester were studied. Optimized M-BT resin system were synthesized via orthogonal experiment emphasized particularly on dielectric properties, flexural strength and thermal properties. BMI/DBA-CE resin systems were examined by differential scanning calorimetry (DSC) to define its curing temperature and activation energy.更多还原