【作者】 叶尚辉； 宋才生； 付长清； 刘勇军；

【Author】 YE Shanghui, Song Caisheng, FU Changqin Liu Yongjiu(Department of Chemistry, Jiangxi Normal University)

【机构】 江西师范大学化学学院；

【摘要】 <正> 耐高温热塑性树脂基复合材料因其优异的性能,近年来发展迅速,已在高技术领域得到广泛的应用。以PEEK为基体的复合材料尤其得到重视。由于这类热塑性高分子基体材料的粘弹性大,在成型过程中树脂与纤维束的浸渍性能差,因此工业上往往采用有机硅烷类偶联剂米改善有机/无机界面作用,提高填料与有机基体之间的黏结力。而有机硅树脂本身俱有优异的耐热、耐寒、耐候、憎水等特性。本文制得了二苄基二甲硅烷(DPMDMS),通过与4,4’-二苯氧基二苯砜(DPODPS)、对苯二甲酰氯(TPC)低温共缩聚,合成了系列主链含硅杂化型聚醚砜醚酮酮(Si-PESPKK)树脂,用FT—IR,DSC,WADX等进行了表征。更多还原

【Abstract】 PESEKK/PKKS copolymers of high molecular weight have been synthesis by solution polycondensation of 4,4’-diphenocydiphenyl sulfone, dimethylbis(phenylmethyl)silane and terephthaloyl chloride in a catalyst/solvent system of AlCl3/ClCH2CH2Cl/NMP/CaCl2. The copolymers have been characterized by FT-IR, WAXD, DSC. The results indicate that the copolymers exhibit excellent heat-resistance, Raising PESEK.K content in the copolymer increases the Tg and Tm of the polymer, compared with PEEK, the polymers have excellent solubility and lower melting temperature and higher Tg, which will be better for process.更多还原