节点文献
微声学器件封装特性研究
Study on Packaging Characteristics of Micro Acoustic Devices
【Author】 YANG Yi REN Tian-ling CAI Jian WANG Shui-di LIU Li-tian (Institute of Microetectronics,Tsinghua University,Beijing 100084,China)
【机构】 清华大学微电子学研究所;
【摘要】 分别采用 TO-CAN 和 SMT 形式对微声学器件进行了封装,并对封装后的器件进行了耦合腔测试和指向性测试。测试结果表明,通过减小前入声孔直径大小,能够抑制微音频器件的高频响应;另外通过采用不同的封装结构参数,能够实现∞形和心脏形指向性的微超声器件。
【Abstract】 The micro acoustic devices were packaged by TO CAN and SMT(surface mount tech- nology)respectively.Frequency response and directive property of the packaged devices were measured by coupled cavity technique and corresponding setups.Test results reveal that high fre- quency response of micro audio frequency devices can be suppressed by decreasing the diameter of front inlet hole for sound.Different packaging parameters of micro ultrasonic devices result in ∞- shape and cordate directivity.
- 【会议录名称】 第十届全国敏感元件与传感器学术会议论文集
- 【会议名称】第十届全国敏感元件与传感器学术会议
- 【会议时间】2007-08
- 【会议地点】中国北京
- 【分类号】TN305.94
- 【主办单位】全国敏感元件与传感器学术团体联合组织委员会