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FBG传感器封装工艺对交叉敏感问题的影响
Influence of Fabrication and Installation on the Cross Sensitivity of FBG Strain Sensors
【Author】 ZHANG Wen-tao~(1,2) DAI Jing-yun~1 SUN Bao-chen~1 (1.Key Lab.of Structure Health Monitoring and Control of Hebei Province,Shijiazhuang 050043,China; 2.State Key Laboratory on Integrated Optoelectronics,Institute of Semiconductors,Chinese Academy of Sciences,Beijing 100083,China)
【机构】 河北省大型结构健康诊断与控制重点实验室;
【摘要】 研究了光纤光栅(FBG)应变传感器的封装与安装工艺对温度交叉敏感特性的影响。基于弹性力学理论对表面粘贴式和表面螺栓安装式两种典型的 FBG 应变传感器封装形式的交叉敏感机理进行了理论分析,并对国内几家主要的 FBG 传感器生产商的产品进行了测试。测试结果表明, 表面粘贴式 FBG 应变传感器的温度交叉敏感性要大于表面安装式 FBG 应变传感器,与理论分析的结果相符。
【Abstract】 The influence of packaging and installation of FBG(fiber brrager grating)strain sen- sots on the temperature cross sensitivity were studied.Based on the theory of elasticity,the mechanism of the thermal cross sensitivity of two types of FBG strain sensors was analyzed.Ex- periments were performed using several domestic products.The results show that the stickup- type is more thermal-cross-sensitive than the bolt-mount-type,which is in agreement with the theoretical analysis.
- 【会议录名称】 第十届全国敏感元件与传感器学术会议论文集
- 【会议名称】第十届全国敏感元件与传感器学术会议
- 【会议时间】2007-08
- 【会议地点】中国北京
- 【分类号】TP205
- 【主办单位】全国敏感元件与传感器学术团体联合组织委员会