【作者】 刘圣迁； 刘晓敏； 张志谦； 刘巧明； 夏传义；

【Author】 LIU Sheng-qian, LIU Xiao-min, ZHANG Zhi-qian, LIU Qiao-ming, XIA Chuan-yi(The 13th Research Institute, China Electronics Technology Group Corporation, Shijiazhuang 050051, China)

【机构】 中国电子科技集团公司第十三研究所；

【摘要】 本文对微电子封装化学镀镍生产工艺及应用进行了研究。系统分析了镀液不同工艺条件对镀层的影响,从而确定了镀液浓度、PH值及温度等工艺参数。应用适当的稳定剂,使批量生产的封装微细图形不糊片,无镍粒。用X射线荧光测厚仪及化学分析方法对生产过程中的镀液成分进行测定,确定了维护镀液所用补充液的组分,从而延长了镀液的使用寿命,满足了微电子封装百万件批量生产的要求。更多还原

【Abstract】 The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched. Analyzing the effect of different process conditions to the plating film, the technical parameters such as consistence of plating solution,PH value and temperature etc. were confirmed. Adopting proper stabilizer, the micro-drawings on the packages had no slur and no grain of nickel. Mensurating the components of plating solution which was using with fischerscope X-ray system and chemical analysis method, Components of supplement were confirmed. So the using life of plating solution was prolonged,and million batch produce of microelectronic packaging was achieved.更多还原