【作者】 刘波； 李艳红； 冯立春； 蒋淑芳； 丁友福； 沈京玲； 张存林；

【Author】 LIU Bo LI Yan-hong Feng Li-chun JIANG Shu-fang DING You-fuSHEN Jing-ling ZHANG Cun-lin(Capital Normal University, Beijing, 100037)

【机构】 首都师范大学；

【摘要】 本文介绍了国外锁相红外热成像技术在无损检测领域的发展和现状,阐述锁相热成像技术的基本原理及其技术特点,介绍了一些在航空、航天及太阳电池板领域的典型应用实验。此技术作为一种新兴的手段,与超声C扫描和脉冲式热成像技术进行了比较。尤其对较大面积复合材料及近表面下缺陷深度的成功检测,表明该技术可以作为一种有效定量的检测手段。更多还原

【Abstract】 The objective of the paper is to introduce foreign development and present situation of lock-in Infrared thermal imaging technology in the non-destructive testing (NDT) fields, and to expatiate on the fundamental principle and characteristics of lock-in technology. Some applications are presented in different fields, such as aircraft, spaceflight, and integrated circuits. As a novel technique, lock-in Infrared thermal imaging technology is compared with ultrasonic C-scan and pulse thermography. Especially on the large-scale composite materials and at the defects depth near to the surface.These successful detections indicate the technique can be taken as an effectively quantitative detecting method.更多还原