【作者】 张永锋； 曾翔君； 余小玲； 杨旭；

【Author】 Zhang Yongfeng Zeng Xiangjun Yu Xiaoling Yang Xu

【机构】 西安交通大学电气工程学院；

【摘要】 分析了混合封装的电力电子集成模块的热路模型,并且仿真得出了结壳热阻Rth-jc的s数值仿真结果。讨论了DBC大小,铜基板大小、形状与结壳热阻的关系,为功率模块的结构设计提供了参考。更多还原

【Abstract】 Thermal circuit model of a hybrid integrated power electronic module (IPEM) is analy- zed in this paper, and then the numerical simulation result of Rth-jc (the thermal resistance from junction to case) is obtained. The relation between Rth-jc and the sizes of DBC ,the relation between Rth-jc and the size ,the shape of the copper soleplate are discussed in this paper, which can help to design the structure of the power module.更多还原