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SiC_p/Cu纳米复合材料的制备
Preparation of SiC_p/Cu Nanocomposite
【Author】 Gu Wanli Lv Weiwei (School of Mechanical Engineer, Shandong University of Technology, Zibo, 255049)
【机构】 山东理工大学机械工程学院;
【摘要】 采用球磨法制备了SiC/Cu混合粉末,并把球磨不同时间后的混合粉末热压成大块复合材料。采用扫描电镜(SEM)对不同球磨时间后的混合粉末以及大块复合材料的组织形貌进行了研究。结果表明:随着球磨时间的增加,纳米SiC 颗粒逐渐嵌入Cu基体中并呈均匀弥散分布。大块纳米SiC/Cu复合材料比纯Cu 材料的硬度有了大幅度提高。
【Abstract】 SiC/Cu mixed-powders were fabricated by using ball milling technique. The mixed powders of milling different time were hot pressed to bulk composite. The microstructures of the powers and the bulk composite were investigated by SEM. The results show that nanoparticulates SiC are embedded in Cu grains gradually, dispersed well and distribute uniformly as the milling time increase. The hardness of the composite increases dramatically compared to the pure Cu materials.
- 【会议录名称】 纳米材料与技术应用进展——第四届全国纳米材料会议论文集
- 【会议名称】第四届全国纳米材料会议
- 【会议时间】2005-12
- 【会议地点】中国山东省烟台市
- 【分类号】TB383.1
- 【主办单位】中国材料研究学会、山东省科学技术厅