节点文献
引线框架铜合金氧化性能的研究
Investigation on Oxidation Characters of Copper Alloys for Lead Frame
【Author】 Huang Fuxiang Suzuki G. Hirowo Ning Honglong Ma Jusheng( Chongqing Institute of Technology, Chongqing,400050)( Tsinghua University, Beijing, 100084 )
【摘要】 本文对引线框架铜合金表面氧化物生长动力学、形貌、成分及铜合金与环氧树脂模塑料(EMC)黏结强度进行了研究。结果表明,CuCrZr系及C19400合金在150-250℃范围内,其表面氧化物生长符合立方规律;C19400合金的氧化速度大于研制合金,其与模塑料的黏结(剪切)强度低于研制合金与模塑料的黏结(剪切)强度。CuCrZr系合金表面氧化膜中含有Cr、Zr元素,使其氧化膜致密;而C19400合金表面氧化膜上有较多的空洞和颗粒,这是导致其与模塑料黏结强度低的主要原因。
【Abstract】 The growth dynamics, morphology, composition of oxide on copper alloys are investigated, the adhesion shear strength of mound component on copper alloys is also studied. The result show that the growth of oxide on copper alloys during 150 ~ 250℃ follow the cubic law. The oxidation rate of C19400 alloy is higher than that of CuCrZr system alloys. The adhesion shear strength of mound component on C19400 alloy is lower than that of mound component on CuCrZr system alloys. There are less coarse second phases in the firms on CuCrZr system alloys than that on C19400 alloy, which result in CuCrZr system alloys possessing higher adhesion strength. There are Cr and Zr in the films on the surface of CuCrZr system alloys, which lead the films dense.
【Key words】 lead frame; copper alloys; oxidation characters; adhesion shear strength;
- 【会议录名称】 2004年材料科学与工程新进展
- 【会议名称】2004年中国材料研讨会
- 【会议时间】2004-11
- 【会议地点】中国北京
- 【分类号】TG174.3
- 【主办单位】中国材料研究学会