【作者】 黄春跃； 吴兆华； 周德俭；

【Author】 Huang Chunyue, Wu Zhaohua, Zhou Dejian(School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, China)

【机构】 桂林电子科技大学机电工程学院；

【摘要】 基于HP37970A数据采集/开关单元,设计了一个PBGA焊点可靠性热循环试验多路数据自动采集系统。该系统包括微机控制、切换开关矩阵、数据采集单元和数据处理计算机四部分,可自动长时间不间断的完成对多个可靠性热循环试验中的PBGA焊点菊花链电阻阻值的微小变化的测量并及时进行焊点失效判断。实际应用表明,该系统可以快速准确地测量出PBGA焊点菊花链电阻的微小变化并实现失效判断,系统具有很高的自动化程度和可靠性。更多还原

【Abstract】 A multi-channel data automatic acquisitioned system was developed for plastic ball grid array(PBGA) solder joints accelerated thermal cycling test based on HP34970A data acquisition/switch unit. This system consists of four parts in functions: single chip computer control, switch array, data acquisitioned unit and data processing computer, it can meet the requirement of long term and uninterrupted measureing the minor changes of PBGA solder joint resistance value and estimating the solder joint failure in time. Actual application indicates that the system measures the minor changes of PBGA solder joint resistance value accurately and estimates the solder joint failure correctly; the system has characteristics of automatization and reliability.更多还原