【作者】 李德刚； 于先进； 董云会； 张丽鹏； 李忠芳；

【Author】 Li Degang Yu Xianjin~* Dong Yunhui Zhang Lipeng Li Zhongfang (School of Chemical Engineering,Shandong University of Technology,Zibo 255049,China)

【机构】 山东理工大学化学工程学院；

【摘要】 采用在直流电基础上叠加正弦波形交流电（交直流叠加技术）的新技术进行电镀铜实验,讨论了电流密度和交流电频率、振幅等条件对镀铜层的平整性、均匀性和细腻性的影响,从而找到较佳的镀铜工艺条件:在温度55～60℃下, 电镀液的成分为CuSO₄·5H₂O 100 g/L,含 H₂SO₄ 200 g/L,交流电频率 f=500 Hz,振幅20 mV,电流密度280 A/m²,镀铜1 h,可获得较平整的镀层和较高的电镀效率。更多还原

【Abstract】 In this paper,a new technology of electrocoppering,that a alternating current signal was superimposed on the direct current,was studed. Analyzed the effect of the current density on the level,homogeneity and exquisite of the copper plating,and then we found the following technological conditions:55-60℃ temperature,100 g/L CuSO₄·5H₂O solution,200 g/L H₂SO₄ solution, f=500 Hz alternating current,E=20 mV,280 A/m² current density,time 1 h,which could gain better plating quality and higher electricity.更多还原