节点文献
电镀锡板表面抗划伤性的研究 Ⅱ.软熔工艺对电镀锡板表面抗划伤性的影响
Study on the Scratch Reistance of Tinplate Surface Ⅱ. Effect of Reflow Technology on the Scratch resistance of Tinplate
【Author】 LIU Xao-bing, CHENG Dan-hong, WANG Xu-cheng, YU Zu-zhan, QIAN Gang (Department of Chemistry, Shanghai University, Shanghai 200436, China; Department of Chemistry, Fudan Univesity, Shanghai 200433, China; Baoshan Iron & Steel Co. Ltd. , Shanghai 200941, China)
【机构】 上海大学化学系; 复旦大学化学系; 宝山钢铁股份有限公司;
【摘要】 移植QHQ型涂膜铅笔划痕硬度仪用来测试电镀锡板的抗划伤性。用此方法研究了软熔处理以及不同软熔方式对电镀锡板抗划伤性的影响,实验结果表明:软熔处理对薄镀锡板可以提高镀锡板表面抗划伤性,在电阻软熔基础上增加感应软熔在一定条件下可以进一步提高电镀锡板的抗划伤性,并从理论上进行了初步探讨。通过对电镀锡板表面形貌观察结果表明,表面抗划伤性与镀层晶粒大小和致密性有关。
【Abstract】 The scratch resistance of tinplate was measured by using modified QHQ type pencil hardness test appratus which is designed for organic paint containg. The effect of reflow treatment and different reflow type on the scratch resistance of tinplate was studied. It was found that resistance reflow treatment, to some extent, can improve the quality of scratch resistance of thin coating tinplate. Furthermore, the resutls obtained also show that adding induction reflow on resistance reflow can further increase the scratch resistance of the tinplate surface. The data obtained indicate that the scratch resistance of tinplate surface relates to the crystal grain size and compactness of the surface tin layer. The possible mechanism of the effect of induction reflow on the scratch resistance was proposed.
【Key words】 tinplate; resistance reflow; induction reflow; scratch resistance; scratch hardness;
- 【会议录名称】 天津市电镀工程学会第九届学术年会论文集
- 【会议名称】天津市电镀工程学会第九届学术年会
- 【会议时间】2002-09
- 【会议地点】中国天津
- 【分类号】TQ153
- 【主办单位】天津市电镀工程学会