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电沉积CoNiMo(P)非晶软磁合金薄膜的工艺优化
The Optimized Process of Electrodeposited CoNiMo(P) amorphous soft-magnetic alloy films
【Author】 ZHOU Qiao-ying~1 YAN A-ru~1 GE Hong-liang~2 SONG Zhen-lun~1 1 Ningbo Institute of Materials Technology and Engineering,Chinese Academy of Sciences Ningbo 315201 2 China Jilian Universit,Hangzhou 310018
【机构】 中国科学院宁波材料技术与工程研究所; 中国计量学院;
【摘要】 铜基底上电沉积制备了 CoNiMo(P)非晶软磁合金薄膜。设计正交实验,并对实验数据进行误差分析,得到制备 CoNiMo(P)非晶软磁合金薄膜的优化工艺条件为.实验表明,优化条件下制备的沉积态 CoNiMo(P)合金薄膜具有非晶态结构、膜面光亮、平整、致密.磁性测量结果显示:CoNiMo(P)合金薄膜的易磁化轴平行于膜面,平行方向上饱和磁化强度(Ms)为142 emu g-1,矫顽力(Hc)为25Oe.与相同条件下制备的纯钴薄膜相比,Ms(?)减小2%,而 Hc 减小84%,软磁性得到了改善。
【Abstract】 CoNiMo(P)amorphous soft-magnetic alloy films was deposited on copper substrates by electrochemical method. Orthogonality analysis method was used to design the experimentation.Under the designed conditions CoNiMo(P)alloy films was prepared.The results suggested that as-deposited CoNiMo(P)alloy films is amorphous and the surface is smooth and compact.The hysteresis loops showed that the easily magnetized axis was parallel to the surface of the films.A saturation magnetization(Ms)of 142 emu g-1and a coercivity(He)of 25 Oe of the film were obtained,as compared with the pure Co films, Ms reduced 2%,Hc decreased 84%,accordingly soft magnetization was improved.
【Key words】 amorphous; soft-magnetic; alloy films; orthogonality; electrodeposition;
- 【会议录名称】 2007年上海市电子电镀学术年会论文集
- 【会议名称】2007年上海市电子电镀学术年会
- 【会议时间】2007-11
- 【会议地点】中国上海
- 【分类号】TB383.2
- 【主办单位】上海市电子学会电子电镀专委会、上海市电镀协会