【作者】 王洪兰； 俞涛； 樊燮昌； 蔡红霞；

【Author】 WANG Hong-lan, YU Tao, FAN Xie-chang, CAI Hong-xia (School of mechanical and Electronic and Automation Shanghai University, Shanghai 200072,china)

【机构】 上海大学机械电子工程与自动化学院；

【摘要】 简要介绍了制造网格MG(Manufacturing Grid)平台以及为何在该平台上应用XML数字签名,描述了XML数字签名技术的原理、签署及其验证过程,并与常规的数字签名技术进行了比较。最后探讨了XML数字签名技术的实现及其在该平台上如何应用该技术。更多还原

【Abstract】 In this paper, platform of Manufacturing Grid and the reason of applying XML Digital Signature on the platform are briefly described. The principle and the process of subscription and validate of XML Digital Signature are then described. The difference between XML and traditional Digital Signature are explained. At last the realization and how to apply XML Digital Signature on the platform are discussed.更多还原