【作者】 潘开林；

【Author】 PAN Kai-lin(Guilin University of Electronic Technology, Guilin 541004, China)

【机构】 桂林电子工业学院机电与交通工程系；

【摘要】 微装配技术是MEMS微制造技术的主要内容之一。自组装技术以其“自组织”特征成为当前的研究热点。在综述当前微装配技术的分类、主要驱动机理及其技术特点的基础上,阐述了基于表面张力作用的MEMS焊点自组装技术的二维分析模型与三维有限元仿真技术。更多还原

【Abstract】 Microassembly technology is one of the important contents in MEMS micromanufacturing technology. Self-assembly technology characterized with "self-ogernization" is becoming the hot topic of MEMS research. The classificztion and their driving mechanism of microassembly were summarized. A simple two-dimensional model and a three-dimensional finite element simulating model for surface tension-powered solder self-assembly were reviewed.更多还原