【作者】 聂京凯； 郑菡晶； 郭福； 夏志东；

【Author】 NIE Jing-kai ZHENG Han-jing GUO Fu XIA Zhi-dong (College of Materials Science & Engineering,Beijing University of Technology,Beijing 100022,China)

【机构】 北京工业大学材料学院；

【摘要】 主要针对不同的再流次数带来的不同热输入对 Ni 颗粒增强复合钎料 IMC 形态的影响进行了深入研究。由前一阶段研究表明,决定 Ni 颗粒增强复合元铅钎料组织变化的关键因素是钎料的钎焊温度与钎料熔点的温度差△T 以及在熔点以上保温时间 t。其本质即外界对钎料的热输入量的大小。随着热输入的增加, Ni 颗粒周围的 IMC 以及钎料\基板界面处的 IMC 都相应变化发展。由于 Ni 颗粒的加入。基板\钎料界面层的结构形态均与 Sn-Ag 共晶钎料有较大不同,Ni 与 Cu₆Sn₅ 的相互作用起到了关键影响。界面层厚度的变化随再流次数增加呈现线性增长。更多还原

【Abstract】 In this research focus of the study was on effect of the thermal input in different reflow times on the morphologies of the IMC in Ni particle reinforced composite Lead-free solder.Previous studies showed that the holding time“t”and the temperature difference“ΔT”in soldering process above the solder melting point play significant roles in changing the microstructure of Ni particle reinforced composite solder.The ultimate factor was determined to be the external thermal input.The IMCs both in the bulk solder region or at the solder/Cu interface showed significant development with the increase of thermal input.The Morphologies of the IMCs at the solder/Cu interface were observed to be so different from Sn-Ag solder due to the addition of the Ni particles.The interaction between Ni and Cu₆Sn₅ was proved to be the critical factor on the thickness increase of the IMCs,which appeared to increase linearly with the increase of reflow times.更多还原