【作者】 符岩； 翟秀静； 张晓顺； 张卓； 马林芝； 范川林； 宋明秋；

【Author】 FU Yan~1 ZHAI Xiu-jing~1 ZHANG Xiao-shun~2 ZHANG Zhuo~1 MA Lin-zhi~1 FAN Chuan-lin~1 SONG Ming-qiu~1 (1 School of Materials & Metallurgy,Northeastern University,Shenyang 110004,China; 2.China Criminal Police University,Shenyang 110035,China)

【机构】 东北大学材料与冶金学院； 中国刑事警察学院；

【摘要】 制备了 Sn-Zn、Sn-Zn-Bi、Sn-Zn-Bi-RE 与 Sn-Zn-Bi-Ag 系无铅焊接合金,研究了合金的熔点、熔化温度区间、对铜板的润湿性、微观结构和电化学性能．实验结果表明：Bi 元素的加入能够降低 Sn-Zn 合金的熔点,但熔化温度区间增大；Bi、Ag、混合 RE 能够细化晶粒,使组织更均匀；电化学研究表明,加入适量的混合 RE 和 Ag 可提高合金的耐腐蚀性．更多还原

【Abstract】 The Sn-Zn,Sn-Zn-Bi,Sn-Zn-Bi-RE and Sn-Zn-Bi-Ag lead-free solder alloy series were prepared in this work. The melting point、melting tempreture range,wettability with copper plate、microstructure and eletrochemical properties of the alloy were investigated.The result showed that the melting point of the Sn-Zn alloy was decrease by adding Bi,but the melting temperature range was wider;the grain was refined and the structure was more homogeneous through Bi and Ag mixed with RE;the eletrochemical study showed that andding the mixture of RE and Ag properly can improve the corrosion resistance of the alloys.更多还原