节点文献
Bi-Sn-In系无铅易熔合金性能研究
Properties of Bi-Sn-In Pb-free fusible alloy
【Author】 YANG Ya-qun~1 WANG Ji-hui~2 LI Qun-ying~2 (1.School of Materials Science and Engineering Yancheng Institute of Technology,Yancheng 224003,China; 2.School of Materials Science and Engineering,Tianjin University,Tianjin 300072,China)
【摘要】 利用 X 射线衍射仪、示差扫描量热分析仪和拉伸试验机,研究了易熔合金 Bi-Sn-In 的成分对合金结构、熔化特性和对黄铜钎焊接头抗拉强度的影响.结果表明:低铟含量的 Bi-Sn-In 易熔合金,由 Bi、β-Sn 和 InBi 相组成;随 In 含量增加,合金由 Bi、BiIn、γ、β、β-Sn、Bi3In5、BiIn2相等组成;在截面Ⅰ(Bi/In= 61.8/28.2),Ⅱ(Bi/In=54.2/35.8),Ⅲ(Bi/In=46.2/43.8) 分别存在一个低共熔点,在截面Ⅳ(Bi/In=34.7/55.3) 存在两个低共熔点;且合金的液相线随 Bi/In 比例的降低而减小;Bi-Sn-In 钎焊接头的抗拉强度随 In 含量的增加呈线性下降,随 Sn 含量的增加而上升.
【Abstract】 The microstructure,melting behaviors and tensile strength of Bi-Sn-In fusible alloys were determined by XRD, DSC and tension tester.The results showed that Bi-Sn-In alloys are composed of Bi,Sn,BiIn,γ,β,Bi3In5,BiIn2 and InBi phases.There were a total of the low melting point in sectionⅠ(Bi/In=61.8/28.2),Ⅱ(Bi/In=54.2/35.8),Ⅲ (Bi/In=46.2/43.8).There were two low melting point in section Ⅳ(Bi/In=34.7/55.3).The tensile strength of soldering joints of Bi-Sn-In alloys rises linearly with the decrease of In content and the increasing of Sn content.
【Key words】 Bi-Sn-In fusible alloy; melting behaviors; tensile strength;
- 【会议录名称】 第六届中国功能材料及其应用学术会议论文集(8)
- 【会议名称】第六届中国功能材料及其应用学术会议
- 【会议时间】2007-11
- 【会议地点】中国湖北武汉
- 【分类号】TG132.31
- 【主办单位】重庆仪器材料研究所、中国仪器仪表学会仪表材料分会、国家仪表功能材料工程技术研究中心