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POSS基有机-无机杂化高分子的制备及低介电性能
Preparation and low dielectric property of POSS-based organic-inorganic hybrid polymer
【Author】 YANG Ben-hong~(2,3) XU Hong-yao~(1,2) GANG Shan-yi~1 LI Cun~2 (1.College of Material Science and Engineering,State Key Laboratory for Modification of Chemical Fibers and Polymeric Materials,Donghua University,Shanghai 201620,China;2.Faculty of Chemistry and Chemical Engineering,Anhui University,Hefei 230039,China;3.Department of Chemical and Material Engineering,Hefei University,Hefei 230022,China)
【机构】 安徽大学化学化工学院; 东华大学材料科学与工程学院纤维高分子材料改性国家重点实验室;
【摘要】 利用硅氢加成反应技术,以多面低聚倍半硅氧烷 T8H8和二(对烯丙氧基苯甲酸)丁二醇酯为单体合成了有机-无机杂化交联聚合物.用 FTIR 和29Si NMR 等对材料进行了结构表征,结果表明,在聚合物中两种单体以化学键相连,无机与有机相均匀分散,T8H8分子中平均有6.3个 Si—H 键与 C=C 双键发生了加成反应, 得到了三维网络聚合物.TGA 分析结果表明,聚合物具有较高的热稳定性,热分解温度为376℃。 Ellipsometer 测试结果表明,聚合物薄膜具有较低的介电常数,k 值为2.4。薄膜表面经三甲基氯硅烷疏水处理后,k 值减小为2.2.
【Abstract】 A novel organic-inorganic hybrid network polymer was prepared via hydrosilylative addition reaction of octahydridosilsesquioxanes with diene.The FrlR and 29Si NMR technologies were employed to characterize the structure of the resultant polymer.The results reveal that diene are chemically bound to each other and well-dispersed in the polymeric system.Averagely,6.3 of the eight Si—H bonds of each POSS have reacted with the C=C bonds of dienes, leading to 3-dimensional network polymers.TGA analysis shows that the hybrid polymer has high thermal stability with a TdOf 376℃.The dielectric constant of the polymeric film was determined to be 2.4,and reduced to 2.2 after treated with trimethylchlorosilane.
【Key words】 polyhedral oligomeric silsesquioxane; hydrosilylation; network polymer; dielectric property;
- 【会议录名称】 第六届中国功能材料及其应用学术会议论文集(2)
- 【会议名称】第六届中国功能材料及其应用学术会议
- 【会议时间】2007-11
- 【会议地点】中国湖北武汉
- 【分类号】TN304
- 【主办单位】重庆仪器材料研究所、中国仪器仪表学会仪表材料分会、国家仪表功能材料工程技术研究中心