【作者】 万媛媛； 李莉； 王丽坤； 秦雷； 魏兵；

【Author】 WAN Yuan-yuan~1 LI Li~(1,2) WANG Li-kun~1 QIN Lei~1 WEI Bing~1 (1.Sensor Technology Research Center,Beijing Information technology Institute,Beijing 100101,China;2.Automatization School,Beijing University of Posts and Telecommunications,Beijing 100876,China)

【机构】 北京信息工程学院传感技术研究中心；

【摘要】 采用磁控溅射工艺以 Cu、Ag 为靶材在1-3 型压电复合材料表面制备电极．研究了两种金属材料的溅射镀膜工艺,系统地分析了溅射功率对金属沉积速率、电极导电性能及附着力的影响．结果表明,两种金属的沉积速率随溅射功率的增加呈线性增加,电极方阻及电阻率均随功率增大而减小,溅射功率为100W 时电极的附着力较好．更多还原

【Abstract】 The Cu and Ag thin films are deposited on 1-3 PZT/epoxy piezoelectric composites by magnetron sputtering. The sputtering parameters,such as sputtering power,deposition rate,conductibility and contact performance of the film have been investigated.Results of the experiment show that the deposition rate of Cu and Ag film increase almost linearly with increasing sputtering power.At the same time,with increasing sputtering power,both the resistance of per square and the resistivity of film decrease.At sputtering power of 100W,the thin film has good contact property.更多还原