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钨铜合金薄板坯烧结行为研究
Sintering behavior of thin W-Cu sheet compact
【Author】 HE Zhao-jun WANG Wei-jin LIU Xiao-ming YANG Ning ZHU Yu-bin (School of Material Science and Engineering,Shanghai University,Shanghai 200072,China)
【机构】 上海大学材料科学与工程学院;
【摘要】 以常规工业级钨粉和铜粉作为原料,制备了厚度均匀、密度较高的钨铜薄板坯,并对该薄板坯的烧结行为进行了系统地研究.结果表明,钨铜两相的润湿性对烧结致密化过程起主导作用,它在各温区所引起的致密化因素各异,使致密度变化程度不同.研究发现, 钨铜在高温液相烧结过程中的动力学特征,与非晶体粘性流动烧结理论相吻合.
【Abstract】 Thin W-Cu sheet compact with uniformity thickness and high density was produced by using commercial powders,and its sintering behavior was studied integrallty.The results show that the principal factor of sintering densification is the wetting property between tungsten and copper,the different change degree of relative density result from diverse factors which were led by wetting property.In addition,pseudo-alloy W-Cu was deemed to noncrystal in the process of liquid phase sintering,the sinter principle of W-Cu alloy was explained by the noncrytal viscous flow sintering theory from the angle of dynamics.
【Key words】 W-Cu alloy; sintering densification; wetting property; sinter principle; noncrytal viscous flow sintering theory;
- 【会议录名称】 第六届中国功能材料及其应用学术会议论文集(2)
- 【会议名称】第六届中国功能材料及其应用学术会议
- 【会议时间】2007-11
- 【会议地点】中国湖北武汉
- 【分类号】TF121
- 【主办单位】重庆仪器材料研究所、中国仪器仪表学会仪表材料分会、国家仪表功能材料工程技术研究中心