【作者】 郭亮； 陈国华；

【Author】 GUO Liang, CHEN Guo-hua (Department of Information Materials Science and Engineering, Guilin University of Electronic Technology, Guilin 541004,China)

【机构】 桂林电子科技大学信息材料科学与工程系；

【摘要】 采用电子陶瓷工艺制备了一系列玻璃／硼酸铝陶瓷复合材料,并对其进行了X射线衍射分析、扫描电镜观察和性能测试。结果表明:当硼酸铝含量≤ 30%(体积比,下同)时,复合材料的介电常数、热膨胀系数和显微硬度随着硼酸铝含量的增加而增加。添加 10％硼酸铝能有效抑制硼玻璃中石英和方石英的析出。所制备的复合材料具有低的介电常数(4．9- 5．4)、低的热膨胀系(≈4．0×10-6／℃)和低的烧结温度(<1000℃),有望用于先进的微电子封装基板材料。更多还原

【Abstract】 A series of glass/ ceramic composites were prepared using electronic ceramics process from borosilicate glass with Aluminum Borate. The sintering behavior and microstructure as well as properties of the composites were investigated by XRD, SEM and physical property measurement. Results show that the thermal expansion coefficient, dielectric constant and hardness of the composites increase with the content of Aluminum Borate when the content of Aluminum Borate is less than (equals to ) 30vol. % The precipitation of cristobalite and quartz in the borosilicate glass is completely inhibited with 10vol. % aluminum borate. The obtained composites exhibit low dielectric constant (4. 9-5. 4) , low thermal expansion coefficient (≈4. 0× 10-6/℃) and low sintering temperature (<1000℃). It is for application as microelectronic packaging substrate.更多还原