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微量Ag对Cu-Cr合金时效性能的影响
Effects of trace Ag on the aging property of Cu-Cr alloy
【作者】 贾淑果; 刘平; 任凤章; 田保红; 郑茂盛; 周根树;
【Author】 JIA Shu-guo, LIU Ping, REN Feng-zhang, TIAN Bao-hong, ZHENG Mao-sheng, ZHOU Gen-shu (School of Materials Science and Engineering, Henan University of Scienceand Technology, Luoyang 471039, China; School of Materials Science and Engineering, Xi’an Jiaotong University, Xi’an 710049,China)
【机构】 河南科技大学材料学院; 西安交通大学材料学院;
【摘要】 采用真空熔炼的方法制备了Cu-Cr和Cu- Ag-Cr合金,通过显微硬度测试、电导率测试、透射电镜分析等方法,对这两种合金的时效性能进行了研究, 并探讨了Ag对Cu-Cr合金时效性能的影响。结果表明:Cu-Ag-Cr合金在440℃时效4h达到电导率和显微硬度的良好结合;微量AR的加入,使得Cu-Cr合金在440℃时效时的峰值硬度约增加6HV,且明显抑制 Cu-Cr合金的过时效。
【Abstract】 By means of a vacuum induction furnace, Cu-Ag-Cr and Cu-Cr alloy are produced. The aging properties of the two alloys are studied, and the influences of trace Ag on the aging properties of the Cu-Cr alloy are discussed by means of tensile test, optical microscopy and transmission electron microscopy. The results showed that Cu-Ag-Cr alloy had an excellent combination of microhardness and electrical conductivity. The peak microhardness of Cu-Cr alloy increased 6HV aged at 440℃ , and the over-aging of the Cu-Cr alloy was restrained effectively due to the trace Ag addition.
- 【会议录名称】 2006年全国功能材料学术年会专辑
- 【会议名称】2006年全国功能材料学术年会
- 【会议时间】2006-07
- 【会议地点】中国甘肃兰州
- 【分类号】TG156.92
- 【主办单位】中国仪器仪表学会仪表材料分会